ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,778, issued on March 11, was assigned to FUJI Corp. (Chiryu, Japan).
"Circuit board manufacturing method and circuit board manufacturing device" was invented by Kenji Tsukada (Toyota, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating an...