ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,468, issued on June 24, was assigned to FUJI Corp. (Chiryu, Japan).
"Inspection device and inspection method for detecting formation of a solder bridge over adjacent electrodes" was invented by Mikiya Suzuki (Nishio, Japan) and Yuta Yokoi (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an inspection device for use in a mounting system including a mounting device for disposing a component on a board, including a control section configured to extract a mass area included in a captured image resulting from imaging a processing target object where a viscous fluid is formed at a predetermined part, obtain a c...