US Patent Issued to FUJI on June 10 for "Analysis device for a component mounting device to analyze board contact of a component" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,825, issued on June 10, was assigned to FUJI Corp. (Chiryu, Japan).

"Analysis device for a component mounting device to analyze board contact of a component" was invented by Hidetoshi Ito (Okazaki, Japan) and Koji Okada (Anjo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The anal...