ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,041, issued on July 22, was assigned to FUJI Corp. (Aichi, Japan).
"Solder ball supply device and solder ball supply method" was invented by Yuji Kawasaki (Nagoya, Japan), Takehito Okada (Anjo, Japan) and Yusuke Yamazaki (Chiryu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder ball supply device is applied to a solder ball feeder including a feeder main body section, a track member, an excitation device, and a cavity unit, and includes an imaging section and a determination section. In the supply region, the cavity unit includes multiple cavities in which one of the multiple solder balls conveyed to the supply region is to be accommoda...