US Patent Issued to FUJI on July 22 for "Circuit forming method" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,259, issued on July 22, was assigned to FUJI Corp. (Chiryu, Japan).

"Circuit forming method" was invented by Kenji Tsukada (Toyota, Japan) and Ryojiro Tominaga (Okazaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit forming method including a first wiring forming step of forming a first metal wiring on a resin layer, and a second wiring forming step of forming a second metal wiring on the first metal wiring, in which a Young's modulus of the first metal wiring and a Young's modulus of the second metal wiring are different from each other."

The patent was filed on Nov. 10, 2020, under Application No. 18/251,445.

*For further inform...