US Patent Issued to FUJI on Feb. 10 for "Method for manufacturing circuit wiring by three-dimensional additive manufacturing" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,268, issued on Feb. 10, was assigned to FUJI Corp. (Chiryu, Japan).

"Method for manufacturing circuit wiring by three-dimensional additive manufacturing" was invented by Ryojiro Tominaga (Okazaki, Japan), Ryo Sakakibara (Anjo, Japan), Tasuku Takeuchi (Kariya, Japan), Yoshitaka Hashimoto (Kariya, Japan) and Kenji Tsukada (Toyota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided...