US Patent Issued to FUJI ELECTRIC on Sept. 9 for "Semiconductor module, semiconductor device and vehicle" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,847, issued on Sept. 9, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).

"Semiconductor module, semiconductor device and vehicle" was invented by Tomoyuki Wakiyama (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a wiring board including a ceramic substrate and conductor patterns on a first surface of the ceramic substrate; a semiconductor element arranged on at least one of the conductor patterns on the first surface of the ceramic substrate; a sealing insulator that seals the wiring board and the semiconductor element; and an insulating member disposed on the first surface of the ceramic subs...