ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,583, issued on Sept. 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor module" was invented by Akio Yamano (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a laminated substrate including an insulating board and a plurality of circuit boards that are arranged on an upper face of the insulating board, the plurality of circuit boards including first and second circuit boards, a semiconductor element disposed on the first circuit board and including, on an upper face of the semiconductor element, a main electrode, a gate pad, and a gate runner electrically connected to the gate...