ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,457, issued on Sept. 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device manufacturing method" was invented by Masanori Tanaka (Matsumoto, Japan) and Akira Furuta (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method includes a molding step including disposing a control pin between an inlet and a control wire and on a line connecting the inlet and the control wire in a plan view of the semiconductor device, injecting molding resin raw material into a cavity through the inlet, filling the cavity with the molding resin raw material, and sealing a semiconductor chip...