ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,507, issued on Sept. 23, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Cooling apparatus and semiconductor module" was invented by Yuta Tamai (Matsumoto, Japan) and Takahiro Koyama (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling apparatus for a semiconductor module including a semiconductor chip includes a top plate having a lower surface a bottom plate disposed to have a refrigerant circulation portion between the bottom plate and the lower surface of the top plate and a side wall configured to surround the refrigerant circulation portion. The side wall includes a fixed portion fixed to the top plate or the ...