US Patent Issued to FUJI ELECTRIC on Oct. 28 for "Semiconductor apparatus and manufacturing method for semiconductor apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,695, issued on Oct. 28, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor apparatus and manufacturing method for semiconductor apparatus" was invented by Daiki Yoshida (Matsumoto, Japan) and Nobuhiro Higashi (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor apparatus includes: (i) a semiconductor device; (ii) a first external connection terminal configured to be connected to the semiconductor device, and includes a first surface; and a second surface; and (iii) an insulating resin enclosure. The first external connection terminal includes: a base part that is embedded in the insulating resin encl...