ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,486, issued on Oct. 21, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and failed element determination method therefor" was invented by Tomohiro Isono (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor module capable of determining a semiconductor chip in which a short-circuit failure has occurred without being disassembled. A semiconductor module includes IGBT provided in each of semiconductor chips connected in parallel, switching of which being controlled by a gate voltage based on a gate signal; two external terminals input with the gate signal; a first connection ...