US Patent Issued to FUJI ELECTRIC on Oct. 21 for "Manufacturing method of packaging structure for bipolar transistor with constricted bumps" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,454, issued on Oct. 21, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Manufacturing method of packaging structure for bipolar transistor with constricted bumps" was invented by Ryoichi Kato (Kawasaki, Japan), Yoshinari Ikeda (Kawasaki, Japan), Tatsuo Nishizawa (Kawasaki, Japan) and Eiji Mochizuki (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a laminated substrate having an insulating plate, a circuit pattern arranged on an upper surface of the insulating plate and a heat dissipating plate arranged on a lower surface of the insulating plate. The semiconductor module also includes a semico...