US Patent Issued to FUJI ELECTRIC on Nov. 18 for "Semiconductor module and method of manufacturing semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,221, issued on Nov. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and method of manufacturing semiconductor module" was invented by Taizo Asano (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module with temperature characteristics adjustable through a measurement device. The semiconductor module includes a mounting board having a semiconductor chip and an integrated circuit mounted thereon. The semiconductor chip includes a switching device and a diode for temperature detection, a forward voltage of the diode being measurable by the measurement device. The integrated circuit inc...