US Patent Issued to FUJI ELECTRIC on Nov. 18 for "Semiconductor module and manufacturing method of semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,158, issued on Nov. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).

"Semiconductor module and manufacturing method of semiconductor module" was invented by Yoshinori Otomo (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor module, including: a semiconductor chip; a terminal, configured to extend in a extending direction, and be connected electrically with the semiconductor chip; a sealing resin, configured to seal the semiconductor chip, and cover at least a part of an upper surface of the terminal and at least a part of a lower surface of the terminal; and a lower side resin, configured to ext...