ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,218, issued on Nov. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device manufacturing method" was invented by Hiroki Takahashi (Sendai, Japan), Tsunehiro Nakajima (Matsumoto, Japan) and Takashi Saito (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "When a semiconductor unit is heated, a heater having a flat heating surface is used for performing heating in a state in which a lower surface of an insulated circuit board is placed on the heating surface. When the semiconductor unit is cooled, a cooler having a cooling surface including a pair of support portions is used for performing cooling in which a l...