US Patent Issued to FUJI ELECTRIC on Nov. 18 for "Semiconductor device and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,196, issued on Nov. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device and semiconductor device manufacturing method" was invented by Yuma Murata (Matsumoto, Japan), Ryoichi Kato (Matsumoto, Japan) and Shinji Tada (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a first case having a first side face, a first insulating paper disposed on the first case and having a first width in a first direction and having a notch with a second width smaller than the first width, a first terminal between the first case and the first insulating paper, having an exposed portion exposed f...