ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,771, issued on Nov. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor device with sealing resin over chip and lead frame" was invented by Kenpei Nakamura (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device including: a lead frame having an upper surface provided with a concave portion and a lower surface provided with a convex portion; a semiconductor chip fixed to the upper surface of the lead frame; a solder layer provided in the concave portion and fixing the semiconductor chip to the upper surface of the lead frame; and a sealing resin for sealing the semiconductor chip a...