US Patent Issued to FUJI ELECTRIC on Nov. 11 for "Semiconductor device and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,762, issued on Nov. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device and manufacturing method therefor" was invented by Naoyuki Kanai (Matsumoto, Japan), Shun Okada (Kawasaki, Japan) and Ryoichi Kato (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a baseplate and a case which includes an external wall surrounding an internal space and a dividing wall extending in a first direction and separating the space into compartments. The dividing wall has a lower end fixed to the principal surface and includes, on a sidewall, a terrace positioned further away from the principa...