ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,838, issued on May 27, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Wiring structure and semiconductor module" was invented by Tadahiko Sato (Kawasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame structure for connecting a semiconductor chip to a connection target includes a conductive member electrically connecting the semiconductor chip and the connection target. The conductive member includes a first bonding part having a main surface, disposed on one side of the conductive member and being bonded to the semiconductor chip, a second bonding part having a main surface, being disposed on another side of the condu...