ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,771, issued on May 27, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor module" was invented by Tomohiro Nishimura (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module is provided, comprising a circuit board having a predetermined circuit pattern, a semiconductor chip placed on the circuit board, a wiring member configured to connect the semiconductor chip and the circuit pattern, and a sealing resin configured to seal the semiconductor chip and the wiring member, wherein the sealing resin has a first resin including an inorganic filler and an epoxy resin, which covers the semiconductor chip...