ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,409, issued on May 13, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Solder material" was invented by Hirohiko Watanabe (Hachioji, Japan), Shunsuke Saito (Hachioji, Japan) and Yoshihiro Kodaira (GuangDong, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrat...