ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,588, issued on May 13, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor module and method for fabricating the same" was invented by Yoshihiko Kawakami (Chino, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor module including: a layered substrate on which a semiconductor chip is provided; and a connection terminal including a connection portion connected to the layered substrate, wherein the connection portion includes at least one ultrasonic connection section, and at least one laser-welded section, at least a portion of which is provided at a location other than a location at which the ultraso...