ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,409, issued on June 17, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor module" was invented by Yasufumi Hara (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor module, including: a semiconductor chip including a semiconductor substrate and a metal electrode provided above the semiconductor substrate; a protective film provided above the metal electrode; a plated layer provided above the metal electrode, having at least a part being in a height identical to the protective film; a solder layer provided above the plated layer; and a lead frame provided above the solder layer, wherein t...