ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,771, issued on June 10, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor module" was invented by Ryoichi Kato (Matsumoto, Japan), Yuma Murata (Matsumoto, Japan) and Naoyuki Kanai (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor module capable of preventing the peeling of a sealing resin on the side where connection sections used for the connection to semiconductor elements are arranged. A semiconductor module includes: an outer frame; sealing resins; gate signal output terminals, and partition sections laid across the outer flame to partition a space into a plurality of housin...