US Patent Issued to FUJI ELECTRIC on July 29 for "Semiconductor module case and method for producing semiconductor module case" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,591, issued on July 29, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module case and method for producing semiconductor module case" was invented by Takanori Sugiyama (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module case formed by injection molding into a box shape using a mold open on a bottom thereof, includes an external terminal disposed on a top face or a side face of the case, the external terminal penetrating through the case from an inside to an outside thereof and being electrically connectable to a semiconductor element inside of the case, and a single first gate for a resin...