ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,068, issued on July 22, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Method of manufacturing semiconductor device" was invented by Yuya Takahashi (Matsumoto, Japan), Shunsuke Tanaka (Matsumoto, Japan) and Kohichi Hashimoto (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device, including preparing a semiconductor wafer having a first main surface and a second main surface opposite to each other, forming a first electrode on the first main surface of the semiconductor wafer, applying a first tape to the second main surface of the semiconductor wafer, so as to cover the second ma...