ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,150, issued on July 15, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Testing method and manufacturing method" was invented by Atsushi Shoji (Matsumoto, Japan) and Akira Nishimura (Suzuka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a testing method for testing a semiconductor device provided with a main element portion including a main transistor portion and a main diode portion, and a sensing transistor portion for current detection, the testing method having: operating an element by causing a diode operation of the sensing transistor portion in the semiconductor device in a chip or wafer state; measuring the elem...