US Patent Issued to FUJI ELECTRIC on July 15 for "Semiconductor module, semiconductor apparatus, and vehicle" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,257, issued on July 15, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module, semiconductor apparatus, and vehicle" was invented by Masahide Kamiya (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a laminate substrate having a first circuit board on which a semiconductor device having a plurality of upper surface electrodes including at least a main electrode is disposed and a second circuit board, a main terminal electrically connected to the main electrode, first and second auxiliary terminals electrically connected to first and second surface electrodes, and a main current ...