ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,331, issued on July 15, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device and manufacturing method thereof" was invented by Hayato Nakano (Kofu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a semiconductor chip, an insulating circuit board having a circuit pattern formed on an insulating plate, a case including a frame part having an opening that is substantially rectangular in a plan view of the semiconductor device, inner wall surfaces of the frame part at the opening forming a storage part to store the insulating circuit board, and a printed circuit board which has a flat plat...