US Patent Issued to FUJI ELECTRIC on Jan. 27 for "Semiconductor apparatus comprising lead frame with recess for wires, and vehicle using the same" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,798, issued on Jan. 27, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor apparatus comprising lead frame with recess for wires, and vehicle using the same" was invented by Hitoshi Nakata (Kawasaki, Japan), Yuichiro Hinata (Kawasaki, Japan) and Naoyuki Kanai (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor apparatus includes a substrate, a semiconductor device arranged on an upper surface of the substrate, a lead frame bonded to an upper surface of the semiconductor device via a bonding material, the lead frame having a first recess on an upper surface thereof, a wire connected to the first reces...