ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,516, issued on Jan. 20, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Manufacturing method containing an oxygen concentration distribution" was invented by Tomoyuki Obata (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device comprising a semiconductor substrate containing oxygen. An oxygen concentration distribution in a depth direction of the semiconductor substrate has a high oxygen concentration part where an oxygen concentration is higher on a further upper surface-side than a center in the depth direction of the semiconductor substrate than in a lower surface of the semiconductor substr...