US Patent Issued to FUJI ELECTRIC on Jan. 13 for "Semiconductor device having semiconductor module on top plate of cooling device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,507, issued on Jan. 13, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device having semiconductor module on top plate of cooling device" was invented by Takahiro Koyama (Matsumoto, Japan), Daiki Yoshida (Matsumoto, Japan), Yuichiro Hinata (Matsumoto, Japan), Takafumi Yamada (Matsumoto, Japan) and Yoshihiro Tateishi (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling device including a rectangular top plate in a plan view having a front surface on which a semiconductor module is disposed and a rear surface having a sidewall connection region, a flow pass region, and an outer edge region. The flow pass...