ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,569, issued on Jan. 13, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device and semiconductor chip" was invented by Akio Yamano (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor chip including a plurality of first control electrodes, each of which is disposed at a respective one of corner portions on a first front surface thereof, a first output electrode disposed on the first front surface, and a first input electrode disposed on a first rear surface thereof, a second semiconductor chip including a plurality of second control electrodes, each of which is d...