US Patent Issued to FUJI ELECTRIC on Jan. 13 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,504, issued on Jan. 13, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device" was invented by Seiichi Takahashi (Matsumoto, Japan), Masayoshi Shimoda (Matsumoto, Japan) and Makoto Isozaki (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip, a bonding member, and a planar laminated substrate having the semiconductor chip bonded to a front surface thereof via the bonding member. The laminated substrate includes a planar ceramic board, a high-potential metal layer, a low-potential metal layer, an intermediate layer. The planar ceramic board contains a plurality...