ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,498, issued on Jan. 13, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device" was invented by Taisuke Fukuda (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a baseplate; an insulating substrate on the baseplate; a semiconductor element on the insulating substrate; a case bonded to the baseplate by an adhesive, the case surrounding a space in which the semiconductor element is positioned; and an encapsulating material filling the space surrounded by the case, in which, the case includes a claw, the claw includes: a protrusion protruding from an inner wall surface of the case; a...