US Patent Issued to FUJI ELECTRIC on Feb. 25 for "Semiconductor module and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,237, issued on Feb. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and manufacturing method therefor" was invented by Tadahiko Sato (Matsumoto, Japan) and Norihiro Nashida (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes first and second semiconductor chips including first and second main electrodes, respectively; first and second connection terminals electrically connected to the first and second main electrodes, respectively; and an insulating sheet. The first connection terminal includes a first conductor portion including a first peripheral edge and a first termina...