US Patent Issued to FUJI ELECTRIC on Dec. 30 for "Semiconductor module and semiconductor module manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,378, issued on Dec. 30, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and semiconductor module manufacturing method" was invented by Takashi Katsuki (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor element made of a wide-bandgap semiconductor, the semiconductor element having an upper surface with an edge, a buffer member that covers the edge of the upper surface of the semiconductor element, and a sealing resin that seals the semiconductor element and the buffer member. The buffer member has a thickness equal to or larger than 50 micro metre."

The pate...