US Patent Issued to FUJI ELECTRIC on Dec. 30 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,388, issued on Dec. 30, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Akira Morozumi (Okaya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an insulated substrate, a semiconductor element mounted on a first main surface side of the insulated substrate, and a case housing that houses the insulated substrate and the semiconductor element so that a second main surface side of the insulated substrate is exposed. The outer circumferential portion of the insulated substrate is bonded to the case housing. The case housin...