ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,043, issued on Dec. 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device" was invented by Takafumi Yamada (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip, an insulated circuit board on which the semiconductor chip is disposed, a cooling plate having a second front surface to which the insulated circuit board is disposed, a bonding member which bonding the insulated circuit board to the cooling plate, a case which surrounds the semiconductor chip and the insulated circuit board and is bonded to the second front surface of the cooling plate with an adh...