US Patent Issued to FUJI ELECTRIC on Dec. 2 for "Semiconductor module, semiconductor device, and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,041, issued on Dec. 2, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module, semiconductor device, and semiconductor device manufacturing method" was invented by Tadahiko Sato (Matsumoto, Japan), Ryoichi Kato (Matsumoto, Japan) and Yuma Murata (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes an insulating sheet which has a first surface and extends in a first direction and a first terminal. The first terminal has a first region disposed on the first surface of the insulating sheet and having a first width in a second direction perpendicular to the first direction, a second reg...