US Patent Issued to FUJI ELECTRIC on Dec. 2 for "Semiconductor device and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,031, issued on Dec. 2, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device and manufacturing method thereof" was invented by Motohito Hori (Matsumoto, Japan) and Yoshinari Ikeda (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a conductor layer, an insulating plate, a circuit pattern layer, and semiconductor chips disposed in this order. The conductor layer has a first through hole. The insulating plate has a second through hole having an opening size larger than the first through hole at a location facing the first through hole. The circuit pattern layer has an opening havin...