ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,140, issued on Dec. 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device and method for manufacturing same" was invented by Hideaki Takahashi (Omachi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a plate-shaped terminal including one main surface and another main surface and having one end electrically connected to a semiconductor chip; a nut arranged on the one main surface side at another end of the terminal; a nut cover provided on the one main surface side at the other end of the terminal and configured to cover the nut; and a case configured to surround the semiconductor ch...