ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,681, issued on Aug. 19, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor device" was invented by Motohito Hori (Nagano, Japan), Yoshinari Ikeda (Nagano, Japan) and Akira Hirao (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor module that includes: an insulating circuit board, a semiconductor chip provided on a main surface of the insulating circuit board, and an external connection terminals provided on the main surface of the insulating circuit board; an external printed circuit board provided so as to face a main surface of the semiconductor module, the external pr...