ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,989, issued on Aug. 12, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor module" was invented by Takanori Sugiyama (Kawasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor element and a molded resin case having a sidewall portion surrounding the semiconductor element. The sidewall portion has an upper surface to which a printed board it to be attached. The sidewall portion has an attachment hole from the upper surface thereof in a depth direction orthogonal to the upper surface, through which a screw is inserted to attach the printed board. The attachment hole is integral...