US Patent Issued to FUJI ELECTRIC, MIE UNIVERSITY on May 20 for "Resin composition with lignin skeleton and resin composition molded article" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,005, issued on May 20, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan) and MIE UNIVERSITY (Tsu, Japan).

"Resin composition with lignin skeleton and resin composition molded article" was invented by Tomoki Hasegawa (Hino, Japan) and Masamitsu Funaoka (Tsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition including a lignin skeleton capable of producing a heat-resistant molded article and being decomposed under relatively mild conditions. The resin composition contains a lignin skeleton including, as a base component, a phenolated lignin or a derivative thereof that contains a reactive monomer group, the phenolated lig...