ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,964, issued on July 8, was assigned to FRONTGRADE TECHNOLOGIES INC. (Colorado Springs, Colo.).
"Under chip bridge" was invented by Sean Thorne (Colorado Springs, Colo.) and Mike Newman (Haywards Heath, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, apparatuses, semiconductor products and methods for semiconductor packages, specifically under chip bridge system-in-packages, are provided that allow one or more bridges to connect two or more dies. For example, high density connections of two or more dies may be connected with an under chip bridge, all of which may be placed on a substrate to form a system-in-package semiconductor ...