US Patent Issued to Fraunhofer-Gesellschaft zur FOrderung der angewandten Forschung, Huawei Technologies Duesseldorf on June 10 for "Massive parallel assembly method" (German Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,751, issued on June 10, was assigned to Fraunhofer-Gesellschaft zur FOrderung der angewandten Forschung e.V. (Munich) and Huawei Technologies Duesseldorf GmbH (Duesseldorf, Germany).

"Massive parallel assembly method" was invented by Hans-Hermann Oppermann (Berlin), Kai Zoschke (Berlin) and Charles-Alix Manier (Berlin).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a device is provided. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the metho...