US Patent Issued to Foshan University on Sept. 16 for "Silver-copper composite conductive paste capable of being sintered at low temperature and preparation method and use thereof" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,860, issued on Sept. 16, was assigned to Foshan University (Foshan, China).

"Silver-copper composite conductive paste capable of being sintered at low temperature and preparation method and use thereof" was invented by Haiying He (Shenzhen, China), Li Hu (Chengdu, China), Zhihao Yang (East Brunswick, N.J.), Wanying Zou (Foshan, China) and Jianzhang Lv (Guangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention belongs to the technical field of packaging interface materials for electronic power devices, and particularly discloses a silver-copper composite conductive paste capable of being sintered at a low temperature, and a prepa...