ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,845, issued on May 6, was assigned to FORTEMEDIA INC. (Alviso, Calif.).

"Package structure of micro speaker" was invented by Yu-Xuan Xu (Hsinchu, Taiwan), Li-Jen Chen (Hsinchu, Taiwan), Yu-Ting Cheng (New Taipei, Taiwan) and Shih-Chin Gong (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure of a micro speaker is provided. The package structure includes a substrate having a hollow chamber, a diaphragm suspended over the hollow chamber, a coil embedded in the diaphragm, a carrier board disposed on a bottom surface of the substrate, a first permanent magnetic element disposed on the carrier board and in the hollow chamber...